ICN contributed to Therminic 2015 (see link below) with a poster on Thermal Characterization of Silver Sintering Paste as Thermal Interface Using the 3-omega Technique and Raman Thermometry. In this work, performed together with Infineon within the Nanotherm project, we showed the application of the 3-omega method for measuring thermal conductivity of multi-layered systems. We have found that excellent thermal coupling between the Si layer and the copper heat sink is achieved through the silver sintered pastes, thus, considerably reducing the thermal boundary resistance between the Si and copper heat sink and optimizing heat transfer between the Si chip and the copper sink. Combining finite-element simulations with experimental measurements we have extracted the thermal conductivity of the silver sintered paste. The high thermal conductivity obtained for the sintered silver TIMs as well as the high effective thermal conductivity measured for the Si-TIM-Cu sub-system demonstrate that the TIM used provides excellent thermal throughput from the Si chip toward the copper heat sink


Therminic 2015:

Press release

Due to its atomic structure with sp2 hybrid orbitals and unique electronic properties, graphene has an extraordinarily high thermal conductivity which has been reported to be up to 5000 W/mK. As a consequence, the use of graphene-based materials for thermal management has been subject to substantial attention during recent years in both academia and industry.

In a recent paper presented at the ECTC conference, Florida, USA, by professor Lius group together with SHT Smart High Tech AB, development of a new type of graphene-based thin film for heat dissipation in power devices is presented. The surface of the developed graphene based film is primarily composed of functionalized graphene oxide, that can be bonded chemically to the device surface and thus minimize the interface thermal resistance caused by surface roughness. A very high in-plane thermal conductivity with a maximum value of 1600 W/mK was detected by laser flash analysis regarding to the graphene-based films.

To investigate the structure of the graphene-based films, scanning electron microscopy (SEM) and raman spectroscopy were carried out. Finally, LED demonstrators were built to illustrate the thermal performance of graphene-based film and the functional layers. IR camera recorded a 5°C lower temperature of a LED demonstrator with the graphene based film as the heat dissipation layer instead of a commercial thermal conductive adhesive.

Ref: Thermal Characterization of Power Devices Using Graphene-based Film, Pengtu Zhang, Nan Wang, Carl Zandén, Lilei Ye, Yifeng Fu and Johan Liu, IEEE Catelog No: 978-1-4799-2407-3/14, CD proceedings of the 2014 Electronic Components & Technology Conference, pp459-463.